マザーボード音質改善設計。Audio PCB Isolation(PCB分離・ノイズ隔離)・High-Grade Audio Capacitor(Nichicon Fine Gold/MUSE)・EMI shielding metal cover・Dual/Triple Headphone Amp(S/H 600ohm)・WIMA FKP2 film cap・Texas Instruments OP-Amp 8920P・ESS ES9280AC DAC(ROG Maximus/AORUS Master)・ASRock Creative Sound Core3D Blaster・2026年ハイエンドマザボ差別化要素。